Industrial SOM platforms from Kingbrother IDH

RK3568 Evaluation Platform

Evaluation board around the Rockchip RK3568 SoC. Quad-core ARM Cortex-A55, integrated 1 TOPS NPU, Mali-G52 GPU. Mid-tier edge compute platform suitable for industrial control, smart terminals, and entry-level edge AI.

• RAM2/4GB LPDDR4
• eMMC32GB eMMC 5.1
• ExpansionM.2 SSD, SATA 3.0

• Ethernet2× Gigabit
• USB2× USB 3.0 Host
• Cellular5G M.2 + 4G Mini PCIe
• CAN1× CAN
• UART2× UART

• HDMI2.0a · up to 4K
• MIPI DSI1× 4-lane
• LVDS2× LVDS
• MIPI CSI2× 4-lane CSI-2

• ModuleSOM + carrier board
• Connector314-pin gold finger
• SOM size82 × 53.5 mm
• OSLinux
• Temp gradeCommercial 0–70°C

RK3588 Edge Computing Box

Flagship edge computing box built around the Rockchip RK3588. big.LITTLE 8-core architecture, 6 TOPS NPU with mixed-precision (INT4/INT8/INT16/FP16). Edge AI workloads, multi-camera AI inference, 8K video processing, industrial AI gateways.

• RAMLPDDR4 8GB
• eMMC32GB
• ExpansionNVMe M.2 + microSD

• Ethernet3× Gigabit + 1× TSN
• USBUSB 2.0 OTG + USB 3.0 Host
• Cellular4G Mini PCIe
• WiFi/BTSDIO module
• CAN3× CAN
• Serial2× RS485 · 2× RS232

• HDMI2.0 · up to 8K@30fps
• Video decode8K@60 H.265/VP9
• MIPI CSI2× DVP 8-bit

• ModuleSOM + carrier board
• SOM size82 × 55 mm
• OSLinux + Android
• Temp gradeCommercial & Industrial (-40 to +85°C)

i.MX6 DualLite Platform

Long-lifecycle NXP i.MX6 DualLite platform. Dual-core ARM Cortex-A9, Vivante GPU, 1080p video codec. Well-suited for mid-tier industrial control, smart terminals, automotive infotainment, and applications requiring NXP's long-term silicon availability.

• RAMDDR3 1/2GB
• eMMC8GB
• Other1× TF card slot

• USB1× OTG · 4× Host (via hub)
• Ethernet1× Fast Ethernet
• WiFi/BTSDIO 2T2R module
• CAN / RS4851× each

• HDMI2.0
• RGB LCD1× output
• CSI1× 8-bit parallel

• ModuleSOM + carrier board
• SOM size67.63 × 36.81 mm
• OSLinux + Android
• Temp gradeCommercial & Industrial

i.MX 8M Plus Platform

NXP i.MX 8M Plus platform with integrated NPU. Quad-core Cortex-A53 plus a Cortex-M7 for real-time, 2.3 TOPS NPU, Vivante GC7000UL GPU. Designed for industrial AI applications: predictive maintenance, vision inspection, AI-enhanced HMI.

• RAM3GB LPDDR4 (32-bit)
• eMMC8GB 5.1
• NOR Flash256 Mb SPI
• ExpansionM.2 SSD

• Ethernet1× Gigabit TSN + 1× RGMII
• USB2× USB 3.0 + 1× Type-C DRP
• Cellular5G M.2 + 4G Mini PCIe
• CAN2× CAN FD

• HDMI2.0a · up to 4K
• MIPI DSI1× 4-lane
• LVDS2× LVDS
• MIPI CSI2× 4-lane CSI-2

• ModuleSOM (gold finger) + carrier board
• OSLinux
• Temp gradeCommercial & Industrial (-40 to +85°C)

i.MX 93 Platform

NXP i.MX 93 — the newest NXP platform in this catalog. Dual-core Cortex-A55 at 1.7 GHz plus a real-time Cortex-M33 at 250 MHz, with a 0.5 TOPS NPU supporting mixed INT8/INT16. Designed for cost-sensitive industrial IoT, smart sensors, building automation, HMI, and edge applications that need a small NPU footprint with NXP-grade long lifecycle.

• RAMLPDDR4/4x 1/2GB
• eMMC16GB
• Other1× TF card slot

• Ethernet2× Gigabit
• USB1× OTG · 3× Host (via hub)
• WiFi/BTSDIO module
• Cellular4G module connector
• CAN1× CAN

• MIPI DSI1× output
• LVDS1× output
• VPU decodeH.265 4K@30 · H.264 1080p@60
• VPU encodeH.264 / H.265 1080p@30
• GPU2D accelerator + PXP compositor

• ModuleSOM + carrier board
• SOM size51 × 42 mm
• OSLinux
• Temp gradeCommercial & Industrial (-40 to +85°C)

A40i Platform

Entry-level Allwinner A40i platform. Quad-core Cortex-A7 — older but mature architecture. Cost-optimized for HMI, simple industrial controllers, and applications where Cortex-A7 performance is sufficient and BOM cost matters most.

• Ethernet1× Gigabit + 1× Fast Ethernet
• USBUSB 2.0 + Micro USB
• CellularMini PCIe (4G)
• DisplayHDMI, LVDS, MIPI DSI
• CSI2× 8-bit
• StorageSATA + TF card
• IndustrialCAN, RS232, RS485

• ModuleSOM + carrier board
• SOM size70 × 55 mm

T507 Platform

Allwinner T507H — quad-core Cortex-A53 meeting automotive-grade AEC-Q100 qualification. 4K@60fps H.265/VP9/AVS2 decode and 4K@25fps H.264 encode. Integrated 3D noise reduction, automatic color adjustment, and keystone correction. General-purpose industrial platform, HMI, smart kiosks, in-vehicle infotainment, digital signage.

• RAMLPDDR4 1/2/4GB
• eMMC16GB
• OtherTF card + SATA 3.0

• Ethernet1× Gigabit + 1× Fast
• USB1× OTG · 4× Host
• Cellular4G Mini PCIe
• WiFi/BTSDIO module
• CAN1× CAN
• Serial1× RS485 · 1× RS232

• HDMI2.0
• LVDS1× 8-lane
• MIPI CSI1× 4-lane
• Parallel CSI1× 8-bit
• Video decode4K@60 H.265/VP9/AVS2
• Video encode4K@25 H.264

• ModuleSOM + carrier board
• SOM size60 × 42 mm
• QualificationAEC-Q100 automotive
• Temp gradeCommercial & Industrial (-40 to +85°C)

T527 Platform

High-end Allwinner T527. Eight cores total (asymmetric big.LITTLE-style across A55 frequencies), 2 TOPS NPU. Positioned as Allwinner's answer to RK3568-class edge AI workloads, often at competitive BOM cost.

• PositionHigh-end Allwinner with NPU
• Best forEdge AI, video analytics
• Form factorSOM + EVK
• Competes withRK3568

Full specifications not detailed in the published manual page; contact Kingbrother for the complete EVK datasheet.

Jetson AGX Xavier Platform

The only NVIDIA option in this catalog. Eight-core Carmel ARMv8.2 paired with a 512-core Volta GPU and 64 Tensor Cores — 32 TOPS of AI compute, well beyond what Rockchip RK3588 or NXP i.MX 8M Plus offer. Industrial-grade only (-40 to +85°C). Built for autonomous machines, multi-camera vision AI, robotics, and heavy edge inference workloads where the silicon premium is justified.

• RAM32GB LPDDR4x
• eMMC32GB
• ExpansionM.2 SSD · 1× TF card

• Ethernet1× Gigabit
• USB3× USB 3.0 Host
• Cellular5G M.2 + 4G Mini PCIe
• CAN2× CAN
• UART5× UART
• SDIO / SPI1× each

• HDMI1.4 · 1080p@60fps
• MIPI CSI4× 4-lane CSI-2
• Video decode2× 8K@30 H.265
• Video encode8× 4K@30 H.265
• Audio3.5mm jack

• ModuleSOM + carrier board
• Carrier size170 × 170 mm
• OSLinux (NVIDIA JetPack)
• DebugJTAG + USB-to-TTL
• Temp gradeIndustrial only (-40 to +85°C)

Zynq-7020 Platform

The outlier in this catalog. Xilinx Zynq-7020 (XC7Z020) combines dual ARM Cortex-A9 cores with Artix-7 FPGA fabric on the same 28nm die. PS and PL can be developed independently — the PS configures and loads programs into the PL. Designed for applications that need real-time deterministic logic alongside an embedded Linux SoC: machine vision, motor control, software-defined radio, custom protocol bridges.

• RAM1GB DDR3 (PS-side)
• eMMC8GB 5.1
• QSPI Flash256 Mb
• Other1× TF card slot

• Ethernet1× Gigabit (onboard)
• USB1× USB 2.0 Host
• CAN2× CAN
• UART2× UART
• SPI1× SPI
• GPIO50× GPIO

• HDMI1× output

• ModuleSOM (DDR4 gold finger) + carrier
• SOM size50 × 50 mm
• Carrier width140 mm
• Process28 nm
• DebugJTAG + TTL UART
• Temp gradeCommercial & Industrial (-40 to +85°C)